The solder cream jars are placed in 45 angle, and run around its axis line, so the solder cream will not ahere to the jar cover.
Double security design to asure the safety of operators.
The air bubbles can be eliminated while the solder paste is being mixed. .
The contorl of the solder paste mixing is considered fully with using special control circuit.
The rotating speed has proved by practice, so the impact against the tin power and the effect to solder paste quality in the rising temperature are avioded.
;)
